学会員メーリングリストアーカイブ (2009年)

[dbjapan] CfP: PerCom 2010 - Paper Submission: Sept. 28, 2009 (FIRM DEADLINE)


Our sincere apologies if you receive multiple copies of this announcement.

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                            CALL FOR PAPERS

Eighth IEEE International Conference on Pervasive Computing and Communications
                  PerCom 2010 (http//www.percom.org/)

              Mannheim, Germany, March 29 - April 2, 2010
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      **** Paper Submission --- September 28, 2009 (FIRM DEADLINE) ****

                              Sponsored by

                         IEEE, IEEE Computer Society
                    The University of Texas at Arlington
                           IEEE TCPP,  IEEE TCCC

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IEEE PerCom, now at its eighth edition, is the premier scholarly venue in the areas of pervasive computing and communications, which aim at providing a ubiquitous platform for supporting exciting anytime and anyplace services paradigms. Pervasive computing and communications is a natural outcome of the tremendous advances of a broad spectrum of technologies including wireless networking, sensor networks, mobile and distributed computing, and agent technologies. PerCom 2010 will provide a high profile, leading edge forum for researchers and engineers alike to present state-of-the-art research in the respective fields of pervasive computing and communications. The conference will feature a diverse mixture of presentation forums including core technical sessions, several targeted workshops, demonstrations, keynote speeches and panel discussions from domain experts.


TOPICS

Research contributions are solicited in all areas pertinent to pervasive computing and communications, including:

- Innovative pervasive computing applications
- Programming paradigms for pervasive systems
- Software evolution and maintenance in pervasive systems
- Middleware services and agent technologies
- Adaptive, autonomic and context-aware computing
- Mobile/Wireless computing systems and services in pervasive computing
- Energy-efficient and green pervasive computing
- Communication architectures for pervasive computing
- Ad hoc networks for pervasive communications
- Pervasive opportunistic communications and applications
- Enabling technologies for pervasive systems (e.g., wireless BAN, PAN)
- Positioning and tracking technologies
- Sensors and RFID in pervasive systems
- Multimodal sensing and context for pervasive applications
- Pervasive sensing, perception and semantic interpretation
- Smart devices and intelligent environments
- Trust, security and privacy issues in pervasive systems
- User interfaces and interaction models
- Virtual immersive communications
- Wearable computers
- Standards and interfaces for pervasive computing environments
- Social and economic models for pervasive systems


WORKSHOPS AND AFFILIATED EVENTS

Many workshops will be held in conjunction with the main conference. Workshop papers will be included and indexed in the IEEE digital libraries (Xplore), showing their affiliation with IEEE PerCom. As in the past, PerCom 2010 will also feature a PhD Forum, Demonstrations and a Work-in-Progress Session.  Please visit the conference website for details.


SUBMISSION GUIDELINES

Submitted papers must be unpublished and not considered elsewhere for publication. Also, they must show a significant relevance to pervasive computing and networking. Guidelines for preparing and submitting the manuscript are available on the conference website (http//www.percom.org/). All papers will be managed electronically through EDAS. Submitted papers will undergo a rigorous review process handled by the Technical Program Committee.


MARK WEISER AWARD

The best paper will receive the prestigious Mark Weiser Best Paper Award. Papers of particular merit will be considered for a special issue of the Elsevier journal of Pervasive and Mobile Computing (PMC).


IMPORTANT DATES

 Paper Registration:  Sept. 25, 2009

 Paper Submission:    Sept. 28, 2009 (FIRM DEADLINE)
 Author notification: Dec.  21, 2009
 Camera-ready due:    Jan.  29, 2010


For further Information, please contact Giuseppe Anastasi at <giuseppe.anastasi [at] iet.unipi.it>  or visit the conference website (http://www.percom.org)


ORGANIZING COMMITTEE

General Co-chairs:
 Christian Becker, University of Mannheim, Germany
 Marco Conti, National Research Council, Italy

Program Chair:
 Giuseppe Anastasi, University of Pisa, Italy

Program Vice Chairs:
 Yonghe Liu, University of Texas at Arlington, USA
 Daniela Nicklas, University of Oldenburg, Germany
 Steve Ward, MIT, USA

Steering Committee Chair:
 Mohan Kumar, University of Texas at Arlington, USA

Workshops Co-chairs:
 Jalal Al Muhtadi, King Saud University, Saudi Arabia
 Andrea Passarella, National Research Council, Italy

Keynotes Chair:
 Vinny Cahill, Trinity College Dublin, Ireland

Panels Chair:
 Djamshid Tavangarian, University of Rostock, Germany

Work in Progress Chair:
 Achilles Kameas, University of Patras, Greece
 Joerg Ott, Helsinky University of Technology, Finland

Demo Co-chairs:
 Qi Han, Colorado School of Mines, USA
 Pedro Jose Marron, University of Bonn, Germany

Ph.D. Forum Chair:
 Claudio Bettini, University of Milan, Italy

Industrial Relations Co-chairs:
 Paul Castro, IBM, USA
 Igor Curcio, Nokia, Finland
 York Sure, SAP AG, Germany

Finance and Registration Chair:
 Gergely Záruba, University of Texas at Arlington, USA

Publication Chair:
 Emilio Ancillotti, National Research Council, Italy
 Alessio Vecchio, University of Pisa, Italy

Publicity Co-chairs:
 Franca Delmastro, National Research Council, Italy
 Dinh Q. Phung, Curtin University of Technology, Australia
 Damla Turgut, University of Central Florida, USA
 Zhiwen Yu, Northwestern Polytechnical University, China

Local Arrangements Chair:
 Gregor Schiele, University of Mannheim, Germany

Submission Chair:
 Antonio Pinizzotto, National Research Council, Italy

Website Liaison:
 Nayantara (Tara) Mallesh, University of Texas at Arlington, USA


TECHNICAL PROGRAM COMMITTEE:
  Jalal Al Muhtadi, King Saud University, Saudi Arabia
  Habib Ammari, Hofstra University, USA
  Francisco Ballestreros, Rey Juan Carlos University, Spain
  Stefano Basagni, Northeastern University, USA
  Martin Bauer, NEC Europe, Germany
  Paolo Bellavista, University of Bologna, Italy
  Claudio Bettini, University of Milan, Italy
  Chatschik Bisdikian, IBM TJ Watson Research, USA
  Susanne Boll, University of Oldenburg, Germany
  Luciano Bononi, University of Bologna, Italy
  Roy Campbell, University of Illinois at Urbana-Champaign, USA
  Jiannong Cao, Hong Kong Polytechnic University, HK
  Guohong Cao, Pennsylvania State University, USA
  Surendar Chandra, University of Notre Dame, USA
  Yingying Chen, Stevens Institute of Technology, USA
  Diane J. Cook, Washington State University, USA
  Paolo Costa, Microsoft Research, UK
  Franca Delmastro, National Research Council, Italy
  Karoly Farkas University of West Hungary, Hungary
  Christian Floerkemeier, MIT, USA
  Silvia Giordano, SUSPI, Switzerland
  Tao Gu, University of Southern Denmark, Denmark
  Isabelle Guérin Lassous, Université Lyon I/LIP, France
  Qi Han, Colorado School of Mines, USA
  Robert Harle, University of Cambridge, UK
  Wenbo He, University of New Mexico, USA
  Urs Hengartner, University of Waterloo, Canada
  Manfred Huber, University of Texas at Arlington, USA
  Jadwiga Indulska, University of Queensland Brisbane, Australia
  Vana Kalogeraki, University of California, Riverside, USA
  Achilles Kameas, University of Patras, Greece
  Birgitta König-Ries, Universität Jena, Germany
  Polychronis Koutsakis, Technical University of Crete, Greece
  Mohan Kumar, University of Texas at Arlington, USA
  Bob Kummerfeld, University of Sydney, Australia
  Brent Lagesse, University of Texas at Arlington, USA,
  Seng W. Loke, La Trobe University, Australia
  Ulrike Lucke University of Rostock, Germany
  Paul Lukowicz, University of Passau, Germany
  Xun Luo, Qualcomm Inc., USA
 Marco Mamei, Università di Modena e Reggio Emilia, Italy
  Cecilia Mascolo, University of Cambridge, UK
  Martin Mauve, Heinrich Heine University Düsseldorf, Germany
  Scott Midkiff, Virginia Tech, USA
  Bernhard Mitschang, University of Stuttgart, Germany
  Refik Molva, Eurecom, France
  Paul Muller, University of Kaiserslautern, Germany
  Matt Mutka, Michigan State University, USA
  Klara Nahrstedt, University of Illinois Urbana-Champaign, USA
  Lionel M. Ni, Hong Kong University of Science & Technology, HK
  Joerg Ott, Helsinki University of Technology, Finland
  Justin Mazzola Paluska, MIT, USA,
  Symeon Papavassiliou, National Technical University of Athens, Greece
  Andrea Passarella, National Research Council, Italy
  Tom Pfeifer, Waterford Institute of Technology, Ireland
  Gian Pietro Picco, University of Trento, Italy
  Claudio Pinhanez, IBM T.J. Watson Research Center, USA
  Dinh Phung, Curtin University of Technology, Australia
  Mandayam Raghunath, Google, India
  Tirumale Ramesh, Boeing, USA
  Anand Ranganathan, IBM T.J. Watson Research Center, USA
  Nishkam Ravi, Intel, Santa Clara, USA
  Daniele Riboni, University of Milan, Italy
  Kay Roemer, ETH Zurich, Switzerland
  Alex Rogers, Southampton University, UK
  George Roussos, Birkbeck College, University of London, UK
  Nirmalya Roy, University of Texas at Austin, USA
  Enrico Rukzio, Lancaster University, UK
  Ichiro Satoh, National Institute of Informatics, Japan
  Gregor Schiele, University of Mannheim, Germany
  Albrecht Schmidt, University of Duisburg-Essen, Germany
  Fabio A. Schreiber, Polytechnic of Milan, Italy
  Behrooz Shirazi, Washington State University, USA
  Morris Sloman, Imperial College London, UK,
  Ioannis Stavrakakis, National and Kapodistrian Univ. of Athens, Greece
  Thomas Strang, German Aerospace Center, Germany
  Gerhard Tröster, ETH Zürich, Switzerland
  Gene Tsudik, University of California at Irvine, USA
  Alessio Vecchio, University of Pisa, Italy
  Nalini Venkatasubramamian, University of California at Irvine, USA
  Matthew Wright, University of Texas at Arlington, USA
  Li Xiao, Michigan State University, USA
  David Yates, Bentley University, USA
  Franco Zambonelli, University of Modena and Reggio, Italy
  Gergely Zaruba, University of Texas at Arlington, USA
  Daqing Zhang, GET/INT-National Institute of Telecommunications, France
  Yanchao Zhang, New Jersey Institute of Technology, USA